Description | Core Technology |
Control Mode | Isolated and Fully digital software controlled |
Heat dissipation design | Patent heat dissipation technology for aluminum substrate |
Power density | 20% higher |
EMC | Class 3 / Class B No electrolytic capacitor (except for OBC bus capacitance) |
Reliability | Reliability |
Items | Description | Quanity |
1 | Flexible assembly line | 10 |
2 | ATE Testing | 20 |
3 | Intelligent aging system | 20 |
4 | SMT line | Wave soldering line-3 MI line-2 |
Labs & Testing equipment