| Description | Core Technology |
| Control Mode | Isolated and Fully digital software controlled |
| Heat dissipation design | Patent heat dissipation technology for aluminum substrate |
| Power density | 20% higher |
| EMC | Class 3 / Class B No electrolytic capacitor (except for OBC bus capacitance) |
| Reliability | Reliability |
| Items | Description | Quanity |
| 1 | Flexible assembly line | 10 |
| 2 | ATE Testing | 20 |
| 3 | Intelligent aging system | 20 |
| 4 | SMT line | Wave soldering line-3 MI line-2 |
Labs & Testing equipment
